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Chip Scale Review July • August • 2017

[ChipScaleReview.com]

CONTENTS

July • August 2017

Volume 21, Number 4

Inside the WaferStorm

®

Precision Surface

Processing System, a 200mm silicon wafer on an

automated handler moves toward the proprietary

ImmJET™ heated immersion and a high-

pressure spray chamber. Using a single-wafer

wet etch process for wafer thinning, the solvent

techniques and advanced process control provide

a low-cost alternative to chemical mechanical

polishing and plasma dry etch processes for

advanced packaging applications.

Cove r photog ra ph c o u r te s y of Ve e co

Instruments Inc.

Envision. Innovate. Deliver. CONNECTING People and Technology Amkor Everywhere As one of the world’s largest suppliers of outsourced semiconductor packaging, design, assembly and test services; Amkor helps make “next generation” products a reality. www.amkor.com

DEPARTMENTS

FEATURE ARTICLES

Wafer thinning for advanced packaging applications Laura Mauer, John Taddei, Scott Kroeger, John Clark Veeco Precision Surface Processing 17 22 Optimization of die attach to surface-enhanced lead frames for MSL-1 performance of QFN packages (part 2) Dan Hart MacDermid Enthone Electronics Solutions

Senthil Kanagavel

Alpha Advanced Materials

Gearing up TSVs to solve next-generation application challenges Bruno Morel aveni 10 Market Update 7 OSATS: challenges for revenue growth E. Jan Vardaman TechSearch International Dan Tracy SEMI 44 Industry News 2017 ECTC – a global packaging conference Mark D. Poliks Binghamton University Eric Perfecto GLOBALFOUNDRIES