Chip Scale Review July • August • 2018[ChipScaleReview.com]
Volume 22, Number 4
The International Magazine for Device and Wafer-level Test,
Assembly, and Packaging Addressing
High-density Interconnection of Microelectronic IC's including
3D packages, MEMS, MOEMS,
RF/Wireless, Optoelectronic and Other
Wafer-fabricated Devices for the 21st Century.
STAFFKim Newman Publisher email@example.com Lawrence Michaels Managing Director/Editor firstname.lastname@example.org Debra Vogler Senior Technical Editor email@example.com
CONTRIBUTING EDITORSDr. John L. Lau - Advanced Packaging firstname.lastname@example.org Steffen Kröhnert - Advanced Packaging email@example.com Dr. Ephraim Suhir - Reliability firstname.lastname@example.org
Dr. Andy Mackie (Chair)
Dr. Rolf Aschenbrenner
Dr. Arun Gowda
GE Global Research
Dr. John Lau
ASM Pacific Technology
Dr. Leon Lin Tingyu
National Center for Advanced
Packaging (NCAP China)
Chip Scale Review
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