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Chip Scale Review July • August • 2019

[ChipScaleReview.com]

Summary

A n ew a r c h i t e c t u r e t h a t t a k e s

advantage of interconnect densities that

rival the density within a die can have

benef its in performance, area, yield

and thermal efficiency. The hurdle to

overcome is designing in 3D instead

of stacking 2D designs. Elimination of

the inefficient interfaces between die,

and instead treating these connections

as if they were connections within

the same die, is what opens the door

for these benefits. Furthermore, the

abilit y to use DBI Ult ra allows for

dissimilar die sizes and test abilit y

makes this approach more accessible to

applications in SoC devices.

References

1. G. Q. Zhang, “The rationale and

paradigm of ‘More than Moore,’”

ECTC 2006.

2. F. Von Trapp, “From the ashes of

Moore’s Law: More than Moore has

arrived,” 3DInCites, Feb. 2016.

3. “ S t a t u s o f t h e CMOS I ma g e

Sensor Industry, 2018 Report” Yole

Développement.

4. G. Gao, “Development of low-

temperature direct bond interconnect

technology for die-to-wafer and die-

to-die applications—stacking, yield

improvement, reliability assessment,”

IWLPC 2018.

5. Sony Corp., “Sony develops the

industry’s first*1 3-layer stacked

CMOS image sensor with DRAM

for smartphones,” Feb. 7, 2017.

6. JESD235A, JEDEC Oct. 2013.

7. JESD235B, Nov. 2018.

8. A. Agarwal, “Thermal and electrical

p e r f o r ma n c e o f d i r e c t b o n d

interconnect technology for 2.5D and

3D integrated circuits,” ECTC 2017.

9. M. Lepedus, “Big trouble at 3nm,”

Semiconductor Engineering, June

2018.

10. S . B o r k a r , “ T h e f u t u r e o f

microprocessors,” Communications

of the ACM, May 2011, Vol. 54 No. 5,

pp.: 67-77.

Biography

Javier DeLaCruz is VP of Engineering at XPERI Corporation, San Jose, CA, where he leads the architecture,

design, and simulation team to develop and enable successful introduction of new technologies. He has over 20

years in the field, including work at eSilicon, STATS and MACOM. He also authored over 20 patents and holds

a MS degree from Boston U., and an MBA from Babson College. Email:

javi.delacruz@xperi.com P RoHS