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Chip Scale Review March • April • 2017

[ChipScaleReview.com] High-accuracy metrology for advanced packaging applications Elisabeth Brandl, Markus Heilig, Thomas Uhrmann, Thomas Wagenleitner EV Group 10 Core capabilities of a thermocompression bonder Hugo Pristauz, Alastair Attard, Andreas Mayr Besi Austria GmbH 14

CONTENTS

March • April 2017

Volume 21, Number 2

The cover shows a tool operator measuring the

total thickness variation of an adhesive interlayer

of a temporary bonded wafer by taking 280,000

measurement points. For thickness measurements,

a high number of measurement points is needed

to achieve proper accuracy. Local deviations,

such as particles within the bond interface, have

a significant effect on the subsequent thinning

process, which can lead to wafer breakage and

tool downtime.

Cover image courtesy of EV Group

Envision. Innovate. Deliver. CONNECTING People and Technology Amkor Everywhere As one of the world’s largest suppliers of outsourced semiconductor packaging, design, assembly and test services; Amkor helps make “next generation” products a reality. www.amkor.com

DEPARTMENTS

FEATURE ARTICLES

Executive Briefing 6 Challenges and opportunities for OSATS in today’s semiconductor market Scott Sikorski STATS ChipPAC Industry Events 52 Packaging news from SEMICON Korea Steffen Kroehnert NANIUM S.A

22nd Annual SMTA Pan Pacific Microelectronics Symposium

Tanya Martin

SMTA

ECTC preview

Mark Poliks

Binghamton University

Industry News 56 CSR Staff