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Chip Scale Review March • April • 2017

[ChipScaleReview.com] Future of embedding and fan-out technologies Rao R. Tummala, Venky Sundaram, P.M. Raj, Vanessa Smet, Tailong Shi Georgia Institute of Technology 20 Temporary bonding material with high sensitivity for laser release in advanced packaging processing Kenzo Ohkita, Yooichiroh Maruyama, Hikaru Mizuno, Takashi Mori, Hiroyuki Ishii, Koichi Hasegawa JSR Corporation Optimization of die attach to surface-enhanced lead frames for MSL-1 performance of QFN packages (part 1) Senthil Kanagavel, Dan Hart MacDermid Performance Solutions 3D integration technology for high-density/high-performance ICs Séverine Cheramy, Maud Vinet, Olivier Faynot Leti Inkjet-based additive manufacturing addresses challenges in semiconductor packaging Wouter Brok, Henk Goossens, Klaus Ruhmer Meyer Burger Chip over-test: are ICs tested too much? Dale Ohmart Texas Instruments MEMS sensor testing challenges and requirements Andreas Bursian Xcerra 31 35 39 42 46 50 Glass-based SiP solutions for high-performance/high-frequency RF filters Jeb Flemming, Roger Cook, Tim Mezel, Kyle McWethy 3D Glass Solutions 60

CONTENTS

Volume 21, Number 2

The International Magazine for Device and Wafer-level Test,

Assembly, and Packaging Addressing

High-density Interconnection of Microelectronic IC's including

3D packages, MEMS, MOEMS,

RF/Wireless, Optoelectronic and Other

Wafer-fabricated Devices for the 21st Century.

STAFF

Kim Newman Publisher knewman@chipscalereview.com Lawrence Michaels Managing Director/Editor lmichaels@chipscalereview.com Debra Vogler Senior Technical Editor dvogler@chipscalereview.com

CONTRIBUTING EDITORS

Roger H. Grace - MEMS rgrace@rgrace.com Dr. Ephraim Suhir - Reliability suhire@aol.com Steffen Kröhnert - Advanced Packaging Steffen.Kroehnert@nanium.com

EDITORIAL ADVISORS

Dr. Andy Mackie (Chair)

Indium Corporation

Dr. Rolf Aschenbrenner

Fraunhofer Institute

Joseph Fjelstad

Verdant Electronics

Dr. Arun Gowda

GE Global Research

Dr. John Lau

ASM Pacific Technology

Dr. Leon Lin Tingyu

National Center for Advanced Packaging

(NCAP China)

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subs@chipscalereview.com

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Lawrence Michaels lmichaels@chipscalereview.com

Copyright © 2016 Haley Publishing Inc.

Chip Scale Review (ISSN 1526-1344) is a registered trademark of

Haley Publishing Inc. All rights reserved.

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Chip Scale Review, (ISSN 1526-1344), is published six times a

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POSTMASTER: Send address changes to Chip Scale Review

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FEATURE ARTICLES

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