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Innovative IC, SiP, and MEMS packaging

portfolio to serve dynamic mobility,

IoT, high performance computing,

automotive and AI markets.

PoP

Flip Chip

SiP

WLP

Fanout

FOCoS

2.5D

TSV

Flex

AoP

AiP

Shielding

Wire Bond

Embedded

Substrate

Co-Design

aseglobal.com

@asegroup_global

Package it.

The SiP Company