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Chip Scale Review March • April • 2019

[ChipScaleReview.com] 17 Understanding the impact of silicone contamination on semiconductor package performance Jaimal Williamson Texas Instruments

Technology

Trends

CONTENTS

March • April 2019

Volume 23, Number 2

Whether it’s 5G applications, bioimplantable

electronics, the growing demand for

power devices, or other challenges, the

semiconductor packaging industry, powered

by human brainpower, has always risen

to the occasion. Looking ahead, we may

be looking at artificial intelligence to help

power the future of packaging design,

manufacturing, and test. Enjoy the issue!

47

Industry News

DEPARTMENTS

7

41

10 34 38

The growing demand for power devices

Dan Tracy, Jan Vardaman

TechSearch International, Inc.

69th IEEE EPS ECTC

Automotive IC production wafer test in a zero-defect world

Amy Leong

FormFactor, Inc.

Multiscale models for electroplating of TSVs M. S. Bharathi, K. H. Khoo, H. Ramanarayan, J. Hongmei, S. Wu, C. A. Joshi, S. S. Quek, D. T. Wu, N. Sridhar Institute of High Performance Computing ; L. MingRui National University of Singapore ; K. R. Mangipudi Indian Institute of Technology, Bhubaneshwar ; J. J. Cheng Institute of Materials Research and Engineering 22 Failure relief in WLP and PLP polymer layers Robert L. Hubbard Lambda Technologies, Inc. 30 Packaging of bioimplantable electronics P. Markondeya Raj Florida International University , Nithin Nedumthakady, Rao Tummala Georgia Institute of Technology Testing of high-frequency 5G applications and why simulations are critical to success Jeff Sherry Johnstech International Enabling high-density chip-to-chip connections with a new FOWLP approach Arnita Podpod, Eric Beyne imec

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