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Page Background Chip Scale Review May June 2015 [ChipScaleReview.com] 10 General Specifications FLIPCHIP BONDER - A110 All New 7 Advanced Features! • High Productivity • Precise Accuracy • Auto Height Checking Function • Smart Alignment Function • Intelligent Wafer Table Movement Algorithm • User Friendly HMI • Unit Pick-up PRS Function for Small Die SECTION FLIP CHIP BONDER - A110 PRODUCTIVITY UPH 15,000 ( Based on Dry Run ) ACCURACY X-Y PLACEMENT ±5μm @ 3σ CHIP ROTATION ±0.05 °@ 3σ BONDING HEAD BONDING FORCE 1N~20N ( Programmable from 1N) FOOTPRINT DIMENSION (Wx Dx H) 1,600mm x 1,230mm x 1,600mm WEIGHT 2,600 kg