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Chip Scale Review May June 2015




May • June 2015

Volume 19, Number 3

Advanced solutions to meet your application needs now and for the future... MEMS and sensors for microphones, gyroscopes, accelerometers and pressure, humidity/temperature, fingerprint, light, infrared and fusion sensors Packages not shown at actual size. © 2015 Amkor Technology, Inc. Visit Amkor Technology online for the most current product information MLF ® LGA Cavity MEMS Enabling a Smart Connected World


The DispenseJet 9500 jets underfill for

flip-chips that are attached to an organic

substrate strip in an array layout. Using

non-contact jetting, the fluid is able to

be dispensed close enough to the edge of

the device to minimize keep-out zones.

Capillary force causes the underfill to

flow underneath the die, thereby filling the

spaces between the bumps on the die and

the substrate.

Photo courtesy of Nordson ASYMTEK.

Market Update Fan-out packaging: what can explain such a great potential? Jérôme Azémar, Phil Garrou Yole Développement 5 Guest Editorial Advanced bumping technology and solutions development in mainland China Lin (Leon) Tingyu National Centre for Advanced Packaging (NCAP) 11 Guest Editorial MEMs packaging: heading towards convergence Doug Sparks Hanking Electronics Ltd. 58 Advertiser Index, Advertising Sales 64 Tech Brief KLA-Tencor leverages front-end technologies for packaging inspection and metrology Debra Vogler Sr. Technical Editor, Chip Scale Review 61 Industry News 62