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Page Background Chip Scale Review May June 2015 [] 4 Your Standard in Precision Automation TM Typical Applications Semiconductor Packaging Photonic Packaging MEMS Assembly • Medical Imaging • Multichip Modules • 3D / 2.5D Packaging • Wafer Scale Packaging • RF / Microwave Modules • Optical Engines • LED Assemblies • Laser Diode Bonding • Active Optical Cables • Silicon Photonic Packaging • IR Sensors • Pressure Sensors • Accelerometers • MEMS Gyroscope • Inkjet Assembly TM S Y S T E M S MRSI Systems is a leading supplier of high precision dispense and assembly equipment for the semiconductor and microelectronics industry o ering systems for the manufacture of Microwave, Optical, MCM’s and MEM’s devices. Entering our fourth decade of advanced packaging application experience, MRSI Systems products support multiple interconnect technologies, including epoxy die bonding, In-situ UV attach, eutectic attach, thermo-compression and ip chip bonding. Let us know how we can help you with your automation needs! 101 Billerica Ave. Bldg 3, N Billerica MA 01862 Tel: 978.667.9449 Fax: 978.667.6109 MRSI-705 5 micron Die Bonder MRSI-175 Ag Precision Dispenser Die Bond and Dispense Solutions MRSI-M Series 1-3 Micron Die Bonder