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Chip Scale Review May • June • 2016



May • June 2016

Volume 20, Number 3


A plasma etch module that provides high-

rate, low non-uniformity Si via reveal etch

is important to one of the final and critical

steps in the 3D wafer stacking process flow

(see cover article on p.45). Combining a

high-throughput Si thinning process with

high selectivity to the oxide liners delivers

the smooth wafer surface needed for

the subsequent steps to complete the 3D

process flow.

Photo courtesy of SPTS Technologies

Envision, Invent, Enable Amkor leads the world in innovative IC assembly and test solutions for today’s advanced microelectronics © 2016Amkor Technology, Inc. Visit Amkor Technology online for current product information and locations Connecting People and Technology Guest Editorial 13 8 Impact of wafer-based packaging on the supply chain Brandon Prior Prismark Partners LLC Market Update 5 Major OSATs positioned for growth opportunities in SiP TechSearch International and Chip Scale Review staff Not yet a fan of fan-out? Why you should be! John Ferguson Mentor Graphics

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