Chip Scale Review May • June • 2016[ChipScaleReview.com]
Volume 20, Number 3
The International Magazine for Device and Wafer-level Test,
Assembly, and Packaging Addressing
High-density Interconnection of Microelectronic IC's
including 3D packages, MEMS, MOEMS,
RF/Wireless, Optoelectronic and Other
Wafer-fabricated Devices for the 21st Century.
STAFFKim Newman Publisher email@example.com Lawrence Michaels Managing Director/Editor firstname.lastname@example.org Debra Vogler Senior Technical Editor email@example.com
CONTRIBUTING EDITORSRoger H. Grace Contributing Editor - MEMS firstname.lastname@example.org Jason Mirabito Contributing Editor - Legal email@example.com Dr. Ephraim Suhir Contributing - Editor - Reliability firstname.lastname@example.org
Dr. Andy Mackie (Chair)
Dr. Rolf Aschenbrenner
Dr. Arun Gowda
GE Global Research
Dr. John Lau
ASM Pacific Technology
Dr. Leon Lin Tingyu
National Center for Advanced
Packaging (NCAP China)
Chip Scale Review
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FEATURE ARTICLESYour yield. Your profitability. Your reputation depends on 100% quality assurance for every wafer, device and package. Sonix is the leader in ultrasonic technology and expertise for inspecting wafer bonds, device interconnects and package integrity. Find smaller defects faster, at any layer. Learn more and request a free sample analysis at Sonix.com . QUALITY IS EVERYTHING © 2016 Sonix, In. All rights reserved. Advanced testing technology for emerging automotive applications Dan Stillman Texas Instruments Amy Leong, Ashish Bhardwaj FormFactor, Inc. 18 What is driving advanced packaging platforms development? Thibault Buisson, Santosh Kumar Yole Développement Ron Huemoeller Amkor Technology 32 Design, material, process, and equipment of embedded fan-out wafer/panel-level packaging John H. Lau, Nelson Fan, Li Ming ASMPacific Technology Ltd. Comparison between wet and dry silicon via reveal in 3D backside processing Dave Thomas, Janet Hopkins, HumaAshraf, Jash Patel, OliverAnsell SPTS Technologies Anne Jourdain, Joeri De Vos,AndyMiller, Eric Beyne imec 38 Current state and evolving trends in MEMS packaging MehranMehregany CaseWestern Reserve University 51 Automated inspection between the die improves yield and reliability Scott Balak Rudolph Technologies, Inc. 57 Final test solution for WLCSP devices Andy Nagy Xcerra 59 Plasma dicing methods for thin wafers Christopher Johnston Plasma-Therm LLC 54 45 Chips “face-up” panelization approach for fan-out packaging Boyd Rogers, Debbie Sanchez, Craig Bishop, Cliff Sandstrom, Chris Scanlan, TimOlson Deca Technologies, Inc. 24