Chip Scale Review May • June • 2018[ChipScaleReview.com]
Volume 22, Number 3
The International Magazine for Device and Wafer-level Test,
Assembly, and Packaging Addressing
High-density Interconnection of Microelectronic IC's including
3D packages, MEMS, MOEMS,
RF/Wireless, Optoelectronic and Other
Wafer-fabricated Devices for the 21st Century.
STAFFKim Newman Publisher firstname.lastname@example.org Lawrence Michaels Managing Director/Editor email@example.com Debra Vogler Senior Technical Editor firstname.lastname@example.org
CONTRIBUTING EDITORSDr. John L. Lau - Advanced Packaging email@example.com Steffen Kröhnert - Advanced Packaging firstname.lastname@example.org Dr. Ephraim Suhir - Reliability email@example.com
Dr. Andy Mackie (Chair)
Dr. Rolf Aschenbrenner
Dr. Arun Gowda
GE Global Research
Dr. John Lau
ASM Pacific Technology
Dr. Leon Lin Tingyu
National Center for Advanced
Packaging (NCAP China)
Chip Scale Review
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