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Chip Scale Review May • June • 2019


our main trends are driving

innovation in the automotive

i ndu s t r y: ele c t r i f icat ion ,

aut onomou s d r iv i ng, con ne c t iv it y

and comfor t. Due to environmental

considerations, governments want to

decrease carbon dioxide (CO


) emission

levels by promoting electric cars and

developing clean energy consumption.

While safety has always been a major factor

in modern vehicles, with the expansion of

autonomous vehicles, a lot of investment

has been made to develop even safer cars.

With advanced driver assistance systems

(ADAS) in cars and robotic vehicles,

passengers’ comfort and entertainment are

also becoming a nice “must have” for in-

cabin options.

Today, the automotive industry is looking

more and more to the semiconductor

industry and expectations for the coming

years are getting higher. The car industry

represents US$2.3 trillion with a compound

annual growth rate (CAGR) of +2.7% over

the next five years. Automotive electronics

accounts for US$142 billion with a CAGR

of +7% (

Figure 1

) [1]. The amount of

electronics in a car has increased by 2.5

times since the 90s. Driven by the adoption

of more electronics components in end-

products, the semiconductor industry is

growing strongly.

Although the automotive market has a

greater inertia to change compared to the

consumer market, advanced packaging

technology will become more and more

overriding (see


). As a result, the

packaging market is projected to grow

from US$3.7 billion in 2017 to almost US$7

billion in 2023 [1]. Also, regulations and

qualification needs are getting more specific

for this industry. To respond to the demand

and reduce production costs, original

equipment manufacturers (OEMs) and Tier

1 suppliers have started subcontracting

more from outsourced semiconductor

assembly and test (OSATS) companies.

On one hand, packages need to be

simple, reliable and affordable. On the

other hand, some modules are including

mor e ch ips wit h a h ighe r level of

integration and a higher added value.

With these varied requirements, OSATS

are bei ng given the oppor t unit y to

address these needs. This has been made

possible because OSATS’ manufacturing

t e c h n o l o g i e s a r e g e t t i n g m o r e

sophisticated, thereby enabling them to

handle higher levels of complexity. In

the span of a few years, OSATS’ market

share in automotive packaging has grown


Challenges in automotive packaging technologies

By Emilie Jolivet

[Yole Développement]

and Prasad Dhond

[Amkor Technology, Inc.]

Figure 1:

The automotive industry’s need for advanced technologies continues to drive increasing electronics

content. SOURCE [1]

Figure 2:

2017-2023 Packaging revenue breakdown by the four market drivers for the automotive industry. SOURCE [1]