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Chip Scale Review May • June • 2019


ut omot ive i s one of t he

fastest growing segments

i n t h e s e m i c o n d u c t o r

industry. Due to their long lifecycle,

automotive applications provide a stable

volume base and higher ret u r ns on

investment (

Figure S1

). However, the

automotive business is also tough and

has high barriers to entry. Suppliers

must support long lifecycle products to

ensure business continuity. Automotive

customers are looking for suppliers that

have the highest levels of experience,

technical capability and quality.

The shift towards advanced

packaging in


A l t h o u g h 8 0 % o f

automotive packaging still

uses wire bond technology,

t h e t r e n d i s t o w a r d s

advanced packaging. Flip-

chip ball grid array (FCBGA)

is the most popular advanced

p a ck a ge fo r p r o c e s s o r s

used in advanced driver-

assistance systems (ADAS).

The high I/O count, thermal

and electrical performance

r e q u i r e me n t s o f t h e s e

processors are best supported

using FCBGAs (

Figure S2


L ow- d e n s i t y f a n - o u t

(LDFO) technology is used

fo r pa ck ag i ng mmWave

r a d a r t r a n s c e i v e r s t o

achieve superior electrical

p e r fo r ma nc e . F l i p - ch i p

c h i p - s c a l e p a c k a g i n g

( f c C S P ) i s a l s o u s e d

f o r r a d a r t r a n s c e i v e r s

a n d h i g h - p e r f o r m a n c e

microcontrollers (MCUs) that

were previously packaged in

wire bond BGAs.

Infotainment applications

use processors in system-in-

package (SiP) form factors.

These Si Ps combi ne t he

processor, memory and other support

components together in a standard form

factor such as FCBGA. A modular SiP

approach speeds up time to market

and provides flexibility to car original

equipment manufacturers (OEMs) to

upgrade processors without making

changes to the surrounding circuitry.

Wire bond packages in automotive

A major it y of ana log i nt eg r at ed

c i r cu it s ( ICs) a nd MCUs t h a t a r e

sprinkled all over the car still use wire

bond packages. Wire bond packages have

a long history in automotive electronics,

and will continue to play a cr ucial

part in powertrain, body, and chassis

applications. The focus for automotive

wire bond packages has been to improve

reliability performance using enhanced

material sets. Almost all new automotive

wire bond products now use copper

wire. To achieve higher automotive

reliability, there are many variations of

copper wire being tested. Lead frame

packages use lead frames that undergo

treatments such as roughening for better

adhesion with interfaces to prevent

delamination. For some packages, epoxy

molding compounds (EMCs) with lower

sulf u r content are used to enhance

t he reliabilit y wit h copper wi re i n

automotive applications.


Automotive OSAT challenges

By Prasad Dhond

[Amkor Technology, Inc.]

Figure S1:

Automotive product requirements provide a challenge to any supplier.

Figure S2:

Emerging applications in cars require different types of advanced packages: SOURCE: IHS Markit Teardown