Chip Scale Review May • June • 2019[ChipScaleReview.com]
May • June 2019
Volume 23, Number 3
Automotive applications are driving a
number of packaging technologies, such
as reliability of packaging materials and
screening of SoCs. But flexible hybrid
electronics (e.g., for biosensors and
personal wearable body monitors) and
“More than Moore” nontraditional scaling
are also pushing the packaging market
segment forward. This issue covers the
above topics in detail across a broad swath
of the packaging industry.
Photo courtesy of Brewer Science, Inc.15 Challenges in automotive packaging technologies Emilie Jolivet Yole Développement and Prasad Dhond Amkor Technology, Inc. Technology Trends
DEPARTMENTS7 Stretchable flexible hybrid electronics Marius Ivan Pricos Technologies Inc. 52 International Directory of Wafer Scribing & Dicing Systems 11 Structural plastics for flexible hybrid electronics fabrication Tony D. Flaim and Jennifer See Brewer Science, Inc. 22 OSAT perspective: automotive semiconductor market &manufacturing challenges Asif R. Chowdhury UTAC Group 31 Driving reliability in automotive electronics assembly materials Andy C. Mackie, Andreas Karch, Kay Parker, Erron Pender, Ricky McDonough Indium Corporation 37 Effective screening of automotive SoCs by combining burn-in and system-level test P. Bernardi, D. Calabrese, M. Restifo, F. Almeida, M. Sonza Reorda Politecnico di Torino D. Appello, G. Pollaccia, V. Tancorre, R. Ugioli, G. Zoppi STMicroelectronics Srl 44 Exposed die fan-out wafer-level packaging by transfer molding Sebastiaan H.M. Kersjes, Jurrian L. J. Zijl, Niels de Jong, Henk Wensink Besi Netherlands B.V. 49 Improving Si and SiC wafer dicing yields with thermal laser separation Dirk Lewke, Christian Belgardt, Hans-Ulrich Zühlke, Mandy Gebhardt 3D-Micromac AG 55 Packaging high-performance memory devices Damon Tsai Rudolph Technologies, Inc. 60 Avoiding the downfalls of bond wires with printed interconnects Bryan Germann Optomec Inc.