Chip Scale Review May • June • 2019[ChipScaleReview.com]
Volume 23, Number 3
The International Magazine for Device and Wafer-level Test,
Assembly, and Packaging Addressing
High-density Interconnection of Microelectronic IC's including
3D packages, MEMS, MOEMS,
RF/Wireless, Optoelectronic and Other
Wafer-fabricated Devices for the 21st Century.
STAFFKim Newman Publisher email@example.com Lawrence Michaels Managing Director/Editor firstname.lastname@example.org Debra Vogler Senior Technical Editor email@example.com
CONTRIBUTING EDITORSSteffen Kröhnert - Advanced Packaging firstname.lastname@example.org John L. Lau, Ph.D - Advanced Packaging email@example.com Dr. Ephraim Suhir - Reliability firstname.lastname@example.org Rao R. Tummala, Ph.D - Advanced Packaging email@example.com
Andy Mackie, Ph.D
Rolf Aschenbrenner, Dipl.-Phys.
Arun Gowda, Ph.D
GE Global Research
John Lau, Ph.D
ASM Pacific Technology
Leon Lin Tingyu, Ph.D
National Center for Advanced
Packaging (NCAP China)
Chip Scale Review
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