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64

Chip Scale Review May • June • 2019

[ChipScaleReview.com

]

2.

R. Schueller, [https://www.dfrsolutions

.

com/hubfs/Resources/services/Copper- Wire-Bond-Failure-Mechanisms.pdf]

3.

ht t ps://www.a smi nter nat ional. org/documents/10192/26113343/ edfa1801p22.pdf/c6bad134-86a5-

4b5a-8247-cac7944e05e8/26114482

4.

https://nepp.nasa.gov/index.cfm/21007

5.

https://www.nytimes.com/2005/02/03/ science/space/repair-costs-for-hubble- are-vexing-to-scientists.html

Biography

Bryan Germann is the Aerosol Jet Product Manager at Optomec Inc., St. Paul, MN. He is responsible for

product management of the Aerosol Jet Platforms and print engine products, as well as strategic customer

projects centered around volume production implementations of Aerosol Jet technology. He joined Optomec

in mid-2017, and previously worked for GE Power where he successfully integrated several Optomec Aerosol

Jet print engines for a production application involving printing high-temperature ceramic sensors on

heavy-duty gas turbine blades. His background as a mechanical engineer brings a unique perspective to the

Optomec marketing team as do his insights as an Optomec customer working with high-volume, precision

production applications for Aerosol Jet. He currently holds 13 published patents, and BS and MS degrees in Mechanical

Engineering from the U. of South Carolina (USC).

ADVERTISER

INDEX

Amkor Technology

www.amkor.com

........................................... 1

Aries Electronics

www.arieselec.com

.......................................... 54

ASM Amicra Microtechnologies

www.amicra.asmpt.com

.............. 32

Besi

www.besi.com

............................................................ OBC

Brewer Science

www.brewerscience.com

...................................... 9

Contech Solutions

www.contechsolutions.com

................................... 42

DL Technology

www.dltechnology.com

........................................... 14

E-tec Interconnect

www.e-tec.com

........................................ 3

EV Group

www.evgroup.com

................................................................ 2

Indium Corporation

www.indium.com/HIA

...................................... 39

Ironwood Electronics

www.ironwoodelectronics.com

................... 41

ISC

www.isc21.kr

........................................................................... 17

IWLPC

www.iwlpc.com

........................................................... 59

JMT Inc.

www.jmt21.jp/en

........................................................... 36

Johnstech

www.johnstech.com

.................................................... 4, 5

Leeno Industrial

www.leeno.com

................................................. 25

Muhlbauer

www.muhlbauer.com

..................................................... 62

PacTech

www.pactech.com

......................................................... 6

Plasma Etch

www.plasmaetch.com

.......................................... 61

SEMI

www.semi.org/events

......................................................... 63

Sonix

www.sonix.com

.................................................................... 3

UTAC Group

www.utacgroup.com

................................................. 10

Winway Technology

www.winwayglobal.com

................................ 30

Xperi Invensas

www.invensas.com

................................................. IFC

Yield Engineering Systems

www.yieldengineering.com/csr

................... 20

Zeiss SMT

www.zeiss.com/xray-pcs

............................................... IBC

July August 2019

Space Close June 28th | Materials Close July 8th

For Advertising Inquiries |

ads@chipscalereview.com

Background

In the late 1990s, the Defense Advanced Research Program Agency (DARPA)

initiated a project to develop a new tool specifically designed for the printing

of electronics. The goal of the project, named Mesoscale Integrated Conformal

Electronics (MICE), was to: “Develop a single tool capable of rapid production

of electronics directly from CAD [computer-aided design] models. This tool must

support processing of a wide variety of materials to produce robust, customized

electronic components in a conformal manner on virtually any substrate,

including low-temperature (<200˚C).” The new tool developed under this DARPA

program was named Aerosol Jet and has been applied in hundreds of leading-edge

applications across many industry segments.

The re a re many convent ional and eme rg i ng met hod s avai lable for

manufacturing electronics. For the most part, these methods represent either

adaptations of graphic printing methods, or new technology specifically designed

for printing electronics. For many of today’s more advanced applications, new 3D

manufacturing methods, such as non-contact direct printing, will be required.