Chip Scale Review - May June 2020

FormFactor takes on the challenge with test and measurement solutions to reduce the manufacturing cost of advanced packages. Advanced packaging adds a new vertical dimension to IC layout. Multiple dies merge into single systems with unprecedented interconnect density. Performance goes up. Power consumption goes down. And wafer-level test and measurement becomes nearly essential to guarantee cost-effective fabrication and packaging. Successful verification at this level requires probing and measuring with extraordinary precision, optically, electrically and mechanically. FormFactor not only understands the problem, it’s also providing timely solutions to advance yield knowledge at every phase of wafer level test in advanced IC packaging. Let us help you rise to the occasion. Visit When Moore’s Law no longer gets your ICs where they need to go.