Chip Scale Review November • December • 2016[ChipScaleReview.com]
Rama Alapati received his BS degree
in Chemical Technology from Osmania
U., Hyderabad, India, and a Master’s in
Chemical Engineering from the U. of
Kansas, Lawrence, and is VP, Strategic
Development, at Amkor Technology, Inc.
Mike Kelly received his Master ’s
degrees in Mechanical and Chemical
En g i n e e r i n g a n d i s S r. D i r e c t o r,
Advanc ed Pa ckage & Te chno l ogy
Integration, at Amkor Technology, Inc.
shows a quick high-level summary
of several high-level design considerations.
There are more criteria depending on the
application and specific customer constraints,
such as improved system performance, or
high performance at relatively low energy
dissipation as measured by bandwidth
per unit of energy expended, thermal
performance, or others.
With TSVs commonly accepted as a
solution for advanced IC packaging and
several TVS processes available, today’s
design decisions focus on identifying
the right implementation for specific
applications. To make the correct choice,
there are several design considerations and
tradeoffs. Today’s 2.5D TSV solutions enable
new power and form factor efficient systems.
As a result, many leading original equipment
manufacturers (OEM) of semiconductors
have taken advantage of their flexibility
and ability to achieve performance and
cost goals. While 2.5D technology has
matured, significant effort is underway to
scale the technology to enable faster and
more efficient systems. At the same time,
much of the effort for 2.5D is applicable to
3D packages that will provide even further
performance and system advantages. With
these and other process variations, different
customers have the flexibility to choose the
process that meets their specific needs.
Paul Silvestri received his BS degree
in Electrical Engineering from Florida
Atlantic U. and is Director, TSV Product
Development, at Amkor Technology,
TSV processes and attributes comparison.
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