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38

Chip Scale Review November • December • 2016

[ChipScaleReview.com]

wet bench is not cost-effective at even 8 or

7 gallons.

Figure 5

assumes a baseline chemical

amount and varies the number of wafers

cleaned. Our solution is proven to clean 500

wafers in 6.2 gallons of material. This chart

indicates how the cost would further be affected

by an increase or decrease in the number of

wafers. The new immersion and spray process

technology shows a clear cost advantage. A

lower cost wet bench at 10 gallons may only

compete in long-term cost-of-ownership

if a bath refresh of 8 gallons is able to

successfully clean more than 700 wafers.

Figure 6

indicates the contribution

to cost when having to replace a filter

regularly for a typical wet bench. The cost

adder indicates how much of a $100 filter is

amortized over the cost of each individual

wafer, depending on the number of wafers

cleaned between filter replacement.

Summary

The new immersion and single-wafer

spray process technology evaluated combines

the advantages of sequenced immersion

and single-wafer spray within one tool. This

enables a cost-effective method for stripping

of dry film resists. Activity-based cost

analysis conducted by SavanSys Solutions

LLC, confirms the use of this technology to

be less costly than the conventional batch

wet bench. Improved bath life, efficient

chemical usage, and significant reduction in

filter changes provide the cost savings.

Acknowledgment

ImmJET and WaferStorm are registered

trademarks of Veeco.

Biographies

Laura Mauer received her BS in

Electrical Engineering from New York

U. and her MS in Electrical Engineering

from Syracuse U.; she is currently CTO at

Veeco Precision Surface Processing; email

lmauer@veeco.com

Scott Kroeger received his BA from

Miami U. and his MBA from Case Western

Reserve U. and is currently VP of Marketing

at Veeco Precision Surface Processing.

Amy Lujan received her BS in Chemistry

from The College of William & Mary and

is currently VP of Business Development at

SavanSys Solutions.

Featuring:

•Thin Film Coating

• Lithography

• Grinding

• Dicing

• Sawing

•Test & Measurement

• Plating

• Developing

UNPRECEDENTED OFFERING OF LATE

MODEL 200MM (8") FRONT AND BACK

END TOOLS AND EQUIPMENT - OVER

$38M AT NEW COST

Location: Morocco

Sale closing: 15

th

Dec. 2016

ANNOUNCEMENT

AUCTION SALE

To view and bid on the lots, visit:

http://www.go-dove.com/en/events?cmd=details&event=571065

For further details on technical specification or to arrange an inspection contact:

STEVE TRIBE

Tel.: (0044) 07836 688453

Email:

steve.tribe@liquidityservices.com

DANIEL KRÖGER

Tel.: 0049 8151 9989730

Email:

DanielK@maynards.com In association with Maynards Europe GmbH

Including;

• SUSS MicroTec Mask Aligner & Exposure (2008)

• EVG ‘6200’ Mask Aligner (2010)

• EVG ‘620’ Bond Aligner (2008)

• Optek DPL-24’ Laminators (2008 & 2012)

• Camtek ‘Falcon’ Inspection Tool

• EVG ‘40’ Alignment Measurement System (2008)

• ESI ‘5330’ Laser Drill (2008), MARCH Plasma Tool (2011)

• SUSS MicroTec Spin Coater and Developer (2008)

• SUSS MicroTec Spray Coaters (2010)

• SEMITOOL Spin Rinse Dryers (2008)

• DISCO ‘DFG-840’ Grinders, ADT Dicing Machines (2008)

•Taping Machines, Peel Force Tester, Stereo Microscopes

• Mühlbauer and Hacker Pick & Place Systems (2011)

Figure 5:

Cost sensitivity to number of wafers cleaned.

Figure 6:

Cost sensitivity to filter change frequency.