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Chip Scale Review November • December • 2017

[ChipScaleReview.com] International Directory of Bonding Equipment for 2.5D and 3D Assembly Chip Scale Review staff 34

CONTENTS

November • December 2017

Volume 21, Number 6

The photo shows a close-up of a FormFactor

Pyramid Probe

®

Rocking Beam Interposer

(RBI) probe core. Clearly visible is the tip-

layer membrane on top of the space transformer

membrane, which connects to the core-I/Os on

the four edges of the probe core’s metal frame.

The background photo depicts the probe core

screwed into its 300mm probe card in the test

system for evaluation of large-array fine-pitch

micro-bump probes in Fab-2 at imec.

Photo: Fred Loosen; Photo composition: Ferenc

Fodor and Erik Jan Marinissen – imec, Belgium.

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DEPARTMENTS

7 Executives Speak Out at IWLPC Debra Vogler Chip Scale Review 10 Guest Editorial Heterogeneous integration paving the way beyond silicon scaling limits Louis Burgyan LTEC Corporation 47 Industry News Tech Brief