Chip Scale Review November • December • 2017[ChipScaleReview.com] International Directory of Bonding Equipment for 2.5D and 3D Assembly Chip Scale Review staff 34
November • December 2017
Volume 21, Number 6
The photo shows a close-up of a FormFactor
Rocking Beam Interposer
(RBI) probe core. Clearly visible is the tip-
layer membrane on top of the space transformer
membrane, which connects to the core-I/Os on
the four edges of the probe core’s metal frame.
The background photo depicts the probe core
screwed into its 300mm probe card in the test
system for evaluation of large-array fine-pitch
micro-bump probes in Fab-2 at imec.
Photo: Fred Loosen; Photo composition: Ferenc
Fodor and Erik Jan Marinissen – imec, Belgium.WIRELESS Front-end, Transceiver IoT Connectivity, MEMS, Sensors AUTOMOTIVE POWER MANAGEMENT MIXED-MODE TECHNOLOGY Display, Audio, MEMS, Sensors COMPUTING & NETWORKING Amkor’s SiP technology is an ideal solution for markets that demands smaller size with increased functionality. We have a proven track record as the industry leader in SiP design, assembly and test. Advanced System-in-Package (SiP) Amkor helps make next generation products a reality. www.amkor.com
DEPARTMENTS7 Executives Speak Out at IWLPC Debra Vogler Chip Scale Review 10 Guest Editorial Heterogeneous integration paving the way beyond silicon scaling limits Louis Burgyan LTEC Corporation 47 Industry News Tech Brief