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34

Chip Scale Review November • December • 2017

[ChipScaleReview.com]

Amicra Microtechnologies GmbH

Marie – Curie- Str. 6

93055 Regensburg

Germany

Tel: +49-941-208209 0

Fax: +49-941-208209 9

www.amicra.com

COMPANY HEADQUARTERS

Street Address

City, State, Zip

Country

Telephone

Fax

Website

INTERNATIONAL DIRECTORY OF BONDING EQUIPMENT FOR 2.5D AND 3D ASSEMBLY

Directory data was compiled from company inputs and/or website search and may not be current or all-inclusive as of the date of publication

BONDING TOOLS

WHAT ELSE THEY MAKE

Die Bonders, Flip Chip Bonders

Finetech GmbH & Co. KG

Boxberger Str. 14

12681 Berlin

Germany

Tel: +49 30 936681-0

Fax: +49 30 936681-144

www.finetech.de

Die Bonders

Flip Chip Bonders

Fully-automated Sub-micron Bonders

Thermo-compression Bonders

Thermo-sonic Bonders

Opto-Bonders

SMT Rework Systems

Wafer Ink Systems, Test Systems,

High Speed Dispense Systems

Die Bonders, Flip Chip Bonders

Standard multi chip die bonders

(single head and double head) for eutectic

process and epoxy, incl. flip-chip, as well

as lamination systems, remounters and

test handlers and taping systems

Geringer Halbleitertechnik GmbH & Co. KG

Liebigstrße 1

93092 Barbing

Germany

Tel: +49.9401.9110.50

Fax: +49.9401.9110.51

www.geringer.de

Die Bonders, Flip Chip Bonders

Sawing & Placement, Punch Singulation,

Compression Auto Molding, Cam Press

Trimming, Laser Marking, 3D Vision

Inspection, Pick & Place and Coverlay

Attach/Detach, Glass Attach

Hanmi Semiconductor Inc.

532-2 Gajwa-Dong, Seo-Gu

Incheon

Korea

Tel: +82.32.571.9100

Fax: 82.32.571.9101

www.hanmisemi.com

Eutectic Die Bonder, Epoxy Die Bonder,

Epoxy/Silver Glass Die Bonder

Wire bonders / Peg and bar lead

diode bonders

Hybond Inc.

330 State Place

Escondido, CA 92029

USA

Tel: 760-746-7105

Fax: 760-746-1408

www.hybond.com

Die Bonders

Dalian Jafeng Electronics Co.,Ltd

No.17 Digital 3 Rd. Double D Port Development Zone

Dalian, Liaoning

China

www.visionjafeng.com

Compiled by Chip Scale Review

(408)429-8585

www.chipscalereview.com

Submit all Directory inquires and updates t

o directories@chipscalereview.com

BE Semiconductor Industries N.V.

P.O. Box 90

6920 AB Duiven

Ratio 6

6921 RW Duiven

The Netherlands

Tel: +31 26 319 4500

Fax: +31 26 319 4550

www.besi.com

Die Bonders, Flip Chip Bonders (Datacon)

Meco (plating systems),

Fico (molding / trimming), ESEC

Die Bonders, Flip Chip Bonders

ASM Pacific Technology Limited

12/F Watson Centre

16 Kung Yip Street

Kwai Chung

Hong Kong

Tel: 852 2619 2000

Fax: 852 2619 2118/9

www.asmpacific.com

Various others