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Chip Scale Review November • December • 2017

[] Core capabilities of thermocompression bonding Hugo Pristauz, Alastair Attard, Andreas Mayr Besi Austria GmbH 29 Testing of automotive electronic ICs Davide Appello STMicroelectronics 38 Optimization of speed and accuracy for fan-out die placement Tom Strothmann Kulicke & Soffa 42 25 High-performance insulating adhesive film for high-frequency applications Junya Sato, Shin Teraki, Masaki Yoshida, and Hisao Kondo NAMICS Corporation Cleaning fine-pitch copper pillar flip-chip packages Mike Bixenman KYZEN Corporation 22 Evaluation of advanced probe cards for large-array fine-pitch micro-bumps Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter imec Jörg Kiesewetter, Ken Smith, and Eric Hill FormFactor 16


Volume 21, Number 6

The International Magazine for Device and Wafer-level Test,

Assembly, and Packaging Addressing

High-density Interconnection of Microelectronic IC's including

3D packages, MEMS, MOEMS,

RF/Wireless, Optoelectronic and Other

Wafer-fabricated Devices for the 21st Century.


Kim Newman Publisher Lawrence Michaels Managing Director/Editor Debra Vogler Senior Technical Editor


Roger H. Grace - MEMS Dr. Ephraim Suhir - Reliability Steffen Kröhnert - Advanced Packaging


Dr. Andy Mackie (Chair)

Indium Corporation

Dr. Rolf Aschenbrenner

Fraunhofer Institute

Joseph Fjelstad

Verdant Electronics

Dr. Arun Gowda

GE Global Research

Dr. John Lau

ASM Pacific Technology

Dr. Leon Lin Tingyu

National Center for Advanced Packaging

(NCAP China)


Chip Scale Review

All subscription changes, additions, deletions to any and

all subscriptions should be made by email only to

Advertising Production Inquiries:

Lawrence Michaels

Copyright © 2017 Haley Publishing Inc.

Chip Scale Review (ISSN 1526-1344) is a registered trademark of

Haley Publishing Inc. All rights reserved.

Subscriptions in the U.S. are available without charge to qualified individuals in

the electronics industry. In the U.S. subscriptions by first class mail are $125

per year. Subscriptions outside of the United States are $225 per year to other


Chip Scale Review, (ISSN 1526-1344), is published six times a

year with issues in January-February, March-April, May-June, July-

August, September-October and November-December. Periodical

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