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Page Background Identify and visualize failure locations in advanced packaging technologies. Imagine seeing buried faults in high resolution … non-destructively. ZEISS X-ray microscopes (XRM) provide 3D tomographic data with submicron resolution and contrast for a wide variety of electronics samples, regardless of sample size. With ZEISS XRM, resolution does not degrade as sample sizes increase so whether you are visualizing a 10 mm flip chip package or a 300 mm wafer, you can maintain close to one-micron resolution for any point on your sample. Image courtesy of AMD Failure Analysis Lab, Singapore Cross-sectioning without destroying your sample. ZEISS Xradia 520 Versa Virtual cross section Virtual planar section 2-15 µm voids 2 µm crack