Previous Page  20 / 52 Next Page
Information
Show Menu
Previous Page 20 / 52 Next Page
Page Background

18

Chip Scale Review November • December • 2018

[ChipScaleReview.com]

COMPANY HEADQUARTERS

Street Address

City, State, Zip

Country

Telephone

Fax

Website

INTERNATIONAL DIRECTORY OF BONDING EQUIPMENT FOR 2.5D AND 3D ASSEMBLY

Directory data was compiled from company inputs and/or website search and may not be current or all-inclusive as of the date of publication

BONDING TOOLS

WHAT ELSE THEY MAKE

ASM Amicra Microtechnologies GmbH

Marie-Curie-Str. 6

93055 Regensburg

Germany

Tel: +49 941 208209 500

Fax +49 941 208209 999

www.amicra.com

Die Bonders, Flip Chip Bonders

Wafer Ink Systems, Test Systems,

High Speed Dispense Systems

Die Bonders, Flip Chip Bonders

Standard multi chip die bonders

(single head and double head) for eutectic

process and epoxy, incl. flip-chip, as well

as lamination systems, remounters and

test handlers and taping systems

Geringer Halbleitertechnik GmbH & Co. KG

Liebigstrße 1

93092 Barbing

Germany

Tel: +49.9401.9110.50

Fax: +49.9401.9110.51

www.geringer.de

Die Bonders, Flip Chip Bonders

Sawing & Placement, Punch Singulation,

Compression Auto Molding, Cam Press

Trimming, Laser Marking, 3D Vision

Inspection, Pick & Place and Coverlay

Attach/Detach, Glass Attach

Hanmi Semiconductor Inc.

532-2 Gajwa-Dong, Seo-Gu

Incheon

Korea

Tel: +82.32.571.9100

Fax:+82.32.571.9101

www.hanmisemi.com

Die Bonders

Dalian Jafeng Electronics Co.,Ltd

No.17 Digital 3 Rd. Double D Port Development Zone

Dalian, Liaoning

China

www.visionjafeng.com

Die Attach Bonders, Multi-Chip,

Flip Chip Bonders, Eutectic Process and

epoxy Single head or double head

Ultrasonic Fine Wire Wedge Bonder,

Ultrasonic Heavy Wire Wedge Bonder,

Ultrasonic Heavy Ribbon Bonder,

Ultrasonic Laserbonder,

Large Area Bonder

F & K Delvotec

Bondtechnik GmbH

Daimlerstr. 5-7

85521 Ottobrunn

Germany

Tel: +49 89 - 62995 0

www.fkdelvotec.com

Compiled by Chip Scale Review

(408)429-8585

www.chipscalereview.com

Submit all Directory inquires and updates to

directories@chipscalereview.com

BE Semiconductor Industries N.V.

P.O. Box 90

6920 AB Duiven

Ratio 6

6921 RW Duiven

The Netherlands

Tel: +31 26 319 4500

Fax: +31 26 319 4550

www.besi.com

Die Bonders, Flip Chip Bonders (Datacon)

Meco (plating systems),

Fico (molding / trimming), ESEC

Die Bonders, Flip Chip Bonders

ASM Pacific Technology Limited

19/F, Gateway ts, 8 Cheung Fai Road

Tsing Yi, New Territories

Hong Kong

Tel:+852 2619 2000

Fax: 852 2619 2118/9

www.asmpacific.com

Various others

DIE BONDERS

Note: advertisers during thecalendar year

have company name in bold and logo displayed.

Finetech

560 E Germann Rd. #103

Gilbert, AZ 85297 USA

Tel: 480-893-1630

www.finetechusa.com

Die Bonders

Flip Chip Bonders

Manual Bonders

Fully-automated Bonders

Thermo-compression bonders

Thermo-sonic bonders

Opto-bonders

High force bonders