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Chip Scale Review November • December • 2018

[] 6 Market Update New opportunities in bonding and lithography equipment markets Amandine Pizzagalli Yole Développement 18 International Directory of Bonding Equipment for 2.5D and 3D Assembly 43 Industry News 2018 IWLPC


November • December 2018

Volume 22, Number 6

Collective die-to-wafer bonding enables

heterogeneous integration of dies from

different sources through the use of fusion/

hybrid, adhesive or thermocompression

bonding by a die carrier. The photo shows

a group of compound semiconductor

dies after successful transfer to a 300mm

silicon wafer for further processing.

Cover image courtesy of EV Group

10 Heterogeneous integration by collective die-to-wafer bonding Thomas Uhrmann, Jürgen Burggraf, Mariana Pires, Martin Eibelhuber EV Group 14 High-temperature survivability and the processes it enables Michelle Fowler, Christopher Apanius, Kimberly Yess Brewer Science, Inc. 26 A cold shower for chips Herman Oprins, Tiwei Wei, Vladimir Cherman, Eric Beyne imec 30 Air and liquid cooling solutions advance to meet thermal needs of ICs Josh Perry Advanced Thermal Solutions, Inc. 35 39 Package assembly design kits bring value to semiconductor designs Ruben Fuentes, August Miller, Jonathan Micksch Amkor Technology, Inc. 22 Integration madness Wolfgang Sauter, Mark Kuemerle Avera Semi, a wholly owned subsidiary of GLOBALFOUNDRIES



Technology Trends Making TVs better – it’s all about the package Cody Peterson Rohinni LLC 45 Advanced eWLB solutions for 77GHz ADAS mmWave applications Dian Wang, Fazhi An Calterah Semiconductor Technology (Shanghai) Co., Ltd. Seung Wook Yoon STATS ChipPAC Pte Ltd. JCET Group