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Page Background 3D X-ray Volumetric Measurement for Advanced Semiconductor Package Development Imagine measuring embedded structures in complex 3D semiconductor packages without physically opening the package. ZEISS 3D X-ray microscopes (XRM) overcome the limitations of mechanical cross sections to enable fast, high-resolution, non-destructive 3D metrology for accelerated development and improved production quality control of advanced packages. Featuring: • Submicron resolution • Advanced 3D measurements including: – Dimensional analysis for interconnect: TSV, µbumps and solder – Solder volume – Bond-line thickness measurements for DRAM – Solder extrusion – 3D void analysis • Fast time-to-results Read about our 3D X-ray measurement solution for advanced packaging at www.zeiss.com/versa-measurement . 15 µm Virtual XRM cross section of a TSV- bump structure for solder extrusion for measurements of solder extrusion (in yellow) 3D color rendering shows solder extrusion Solder Extrusion Improving your advanced package processes. ZEISS Xradia 520 Versa Visit us at SEMICON Korea Booth D520