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–Wafer Level Ball-Attach Flux

– Ultrafine-Pitch Solder Paste

– Dispensable Fine-Pitch Solder Paste

3D Logic / Memory and Flip-Chip

Wafer Level Package


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Soldering Materials to Enable

Heterogeneous Integration

–Wafer Bumping (Bump Fusion) Flux

– Flip-Chip Flux

– Ball-Attach Flux

• Ball Grid Array

• Lidded MEMS

• System-in-Package