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Chip Scale Review September • October • 2018

[ChipScaleReview.com]

properties of the material are also critical so that, once cured, the paste

adheres to the floor and trench sidewalls with no separation. Highly

flexible, the newly-developed compartmental materials are compatible

with conventional metal cans, organic metal inks and the new conformal

coating metal inks.

Summary

The speed at which RF devices are being developed and deployed

is staggering, and the challenge to effectively protect them from EMI

interference while accommodating the reduction in package sizes

and increase in functionality has become more pronounced. New

technologies such as conformal coating metal inks – which have been

shown to outperform traditional conductive inks with 80% higher

shielding effectiveness – and compartmental shielding pastes will be

essential for the future of a more reliably connected electronic ecosystem.

Biographies

Xinpei Cao received her PhD degree of Polymer Chemistry

from Zhejiang U., China, and is Senior Principal Engineer at

Henkel Corporation; email

xinpei.cao@henkel.com

Contact Author:

Jinu Choi received his BS degree at Korea

Advanced Institute of Science and Technology (KAIST) and

MBA at U. of California, Irvine. He is a Market Segment Head

at Henkel Corporation; email

jinu.choi@henkel.com

Junbo Gao received a PhD in Polymer Chemistry from Jilin U.

and is a Senior Scientist at Henkel Corporation.

Dan Maslyk received his master’s and bachelor’s degrees in

Electrical Engineering at Auburn U. and is a Senior Applications

Engineer at Henkel Corporation.

Andrew Sun received his BS in Biology from California

State U., Long Beach, and is a Technical Service Engineer at

Henkel Corporation.

Qi z huo Zhuo r e c e ived h i s PhD i n Polyme r Sc ie nc e

f r om U. o f A k r o n a n d i s a Te c h n o l og y Ma n a g e r a t

Henkel Corporation.

Table 2:

Operational and performance comparisons of conformal coated metal

ink vs. PVD (sputtering).

Figure 5:

Compartmental shielding for in-package EMI chip segregation.

© 2017 Brewer Science, Inc. Compatible with: 308 nm 343 nm 355 nm Creating Safe Environments Laser Release System In the laser release system, the device wafer is bonded to a transparent glass carrier using a bonding material and a release material. Once processing is completed, the pair is separated by exposing the release material with an excimer laser or solid-state laser. Low- stress separation coupled with high throughput make the laser release system suitable for all production environments. www. b r e w e r s c i e n c e . c om Laser Release System Benefits: •Highest-throughput system available with a release time of less than 30 seconds •Ultraviolet laser does not heat or penetrate the bulk bonded structure •Low-stress processing through use of CTE- matched carrier and room temperature separation Laser Release Layer Thin Device Wafer Bonding Material Transparent Carrier