Chip Scale Review September • October • 2018[ChipScaleReview.com]
properties of the material are also critical so that, once cured, the paste
adheres to the floor and trench sidewalls with no separation. Highly
flexible, the newly-developed compartmental materials are compatible
with conventional metal cans, organic metal inks and the new conformal
coating metal inks.
The speed at which RF devices are being developed and deployed
is staggering, and the challenge to effectively protect them from EMI
interference while accommodating the reduction in package sizes
and increase in functionality has become more pronounced. New
technologies such as conformal coating metal inks – which have been
shown to outperform traditional conductive inks with 80% higher
shielding effectiveness – and compartmental shielding pastes will be
essential for the future of a more reliably connected electronic ecosystem.
Xinpei Cao received her PhD degree of Polymer Chemistry
from Zhejiang U., China, and is Senior Principal Engineer at
Henkel Corporation; firstname.lastname@example.org
Jinu Choi received his BS degree at Korea
Advanced Institute of Science and Technology (KAIST) and
MBA at U. of California, Irvine. He is a Market Segment Head
at Henkel Corporation; email@example.com
Junbo Gao received a PhD in Polymer Chemistry from Jilin U.
and is a Senior Scientist at Henkel Corporation.
Dan Maslyk received his master’s and bachelor’s degrees in
Electrical Engineering at Auburn U. and is a Senior Applications
Engineer at Henkel Corporation.
Andrew Sun received his BS in Biology from California
State U., Long Beach, and is a Technical Service Engineer at
Qi z huo Zhuo r e c e ived h i s PhD i n Polyme r Sc ie nc e
f r om U. o f A k r o n a n d i s a Te c h n o l og y Ma n a g e r a t
Operational and performance comparisons of conformal coated metal
ink vs. PVD (sputtering).
Compartmental shielding for in-package EMI chip segregation.© 2017 Brewer Science, Inc. Compatible with: 308 nm 343 nm 355 nm Creating Safe Environments Laser Release System In the laser release system, the device wafer is bonded to a transparent glass carrier using a bonding material and a release material. Once processing is completed, the pair is separated by exposing the release material with an excimer laser or solid-state laser. Low- stress separation coupled with high throughput make the laser release system suitable for all production environments. www. b r e w e r s c i e n c e . c om Laser Release System Benefits: •Highest-throughput system available with a release time of less than 30 seconds •Ultraviolet laser does not heat or penetrate the bulk bonded structure •Low-stress processing through use of CTE- matched carrier and room temperature separation Laser Release Layer Thin Device Wafer Bonding Material Transparent Carrier