Chip Scale Review September • October • 2019[ChipScaleReview.com]
on bare dies. ChipInFlex is also the first
packaging solution that can perform
collective thinning on the wafer. The
process has been successfully validated on
an electrical test vehicle. A first step towards
a complete electronic system in a flexible
label has been made. CEA-Leti’s packaging
team is currently developing a demonstrator,
with applications ranging from sensors to
radio frequency identification (RFID) dies.
This work was supported by the French
National Research Agency (ANR) through
Carnot funding and has been performed with
the help of the Plateforme Technologique
Amont in Grenoble, with financial support
from the CNRS Renatech network. The
author would like to acknowledge Ahmad
Itawi, Laetitia Castagné and Carine Ladner
for their contributions to this work.
1. M. Hassan, C. Schomburg, C. Harendt,
E. Penteker, J. N. Burghartz, “Assembly
and embedding of ultra-thin chips
in polymers,” Eur. Microelectronics
Packaging Conf. (EMPC), 2013, pp. 1–6.
2. T. Fukushima, et al., “‘FlexTrate™ -
Scaled heterogeneous integration on
flexible biocompatible substrates using
FOWLP,” Proc. Electron. Comp. Tech.
Conf. (ECTC), 2017, pp. 649–654.
3. M. Bedjaoui, S. Martin, R. Salot,
“Interconnection of flexible lithium
thin-film batteries for systems-in-foil,”
Proc. ECTC, vol. 2016–Aug., 2016, pp.
4. C. Van Hoof, et al., “Design and
integration technology for miniature
medical microsystems,” Tech. Dig., Int.
Electron Devices Meeting (IEDM),
5. A. Itawi, J.-C. Souriau, “Development
of a flexible label integrating a silicon
bare die,” 2018 7th Electron. Syst.
Technol. Conf., 2018, pp. 18–21.
6. J.-C. Souriau, A. Itawi, L. Castagné,
“Wafer-level integration of thin silicon
bare dies within flexible label,” 2019
IEEE 69th ECTC.
Jean-Charles Souriau is project leader and scientific expert on wafer-level packaging at the U. Grenoble
Alpes, CEA, Leti, Grenoble, France. He has a doctorate in Physics in 1993 from the Grenoble U. and has
worked in the field of micro-interconnection and packaging for more than 20 years. He is the lead author of
several publications and more than 10 patents. He is a senior member of the IEEE and president of the French
chapter of the IEEE Electronics Packaging Society. Email: email@example.com
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