Previous Page  13 / 60 Next Page
Information
Show Menu
Previous Page 13 / 60 Next Page
Page Background

11

Chip Scale Review September • October • 2019

[ChipScaleReview.com]

on bare dies. ChipInFlex is also the first

packaging solution that can perform

collective thinning on the wafer. The

process has been successfully validated on

an electrical test vehicle. A first step towards

a complete electronic system in a flexible

label has been made. CEA-Leti’s packaging

team is currently developing a demonstrator,

with applications ranging from sensors to

radio frequency identification (RFID) dies.

Acknowledgements

This work was supported by the French

National Research Agency (ANR) through

Carnot funding and has been performed with

the help of the Plateforme Technologique

Amont in Grenoble, with financial support

from the CNRS Renatech network. The

author would like to acknowledge Ahmad

Itawi, Laetitia Castagné and Carine Ladner

for their contributions to this work.

References

1. M. Hassan, C. Schomburg, C. Harendt,

E. Penteker, J. N. Burghartz, “Assembly

and embedding of ultra-thin chips

in polymers,” Eur. Microelectronics

Packaging Conf. (EMPC), 2013, pp. 1–6.

2. T. Fukushima, et al., “‘FlexTrate™ -

Scaled heterogeneous integration on

flexible biocompatible substrates using

FOWLP,” Proc. Electron. Comp. Tech.

Conf. (ECTC), 2017, pp. 649–654.

3. M. Bedjaoui, S. Martin, R. Salot,

“Interconnection of flexible lithium

thin-film batteries for systems-in-foil,”

Proc. ECTC, vol. 2016–Aug., 2016, pp.

2082–2088.

4. C. Van Hoof, et al., “Design and

integration technology for miniature

medical microsystems,” Tech. Dig., Int.

Electron Devices Meeting (IEDM),

2008.

5. A. Itawi, J.-C. Souriau, “Development

of a flexible label integrating a silicon

bare die,” 2018 7th Electron. Syst.

Technol. Conf., 2018, pp. 18–21.

6. J.-C. Souriau, A. Itawi, L. Castagné,

“Wafer-level integration of thin silicon

bare dies within flexible label,” 2019

IEEE 69th ECTC.

Biography

Jean-Charles Souriau is project leader and scientific expert on wafer-level packaging at the U. Grenoble

Alpes, CEA, Leti, Grenoble, France. He has a doctorate in Physics in 1993 from the Grenoble U. and has

worked in the field of micro-interconnection and packaging for more than 20 years. He is the lead author of

several publications and more than 10 patents. He is a senior member of the IEEE and president of the French

chapter of the IEEE Electronics Packaging Society. Email

: jean-charles.souriau@cea.fr

LEADERS IN

MICRODISPENSING

TECHNOLOGY

Our Micro Dispensing product line is proven and trusted by

manufacturers in semiconductor, electronics assembly, medical

device and electro-mechanical assembly the world over.

www.dltechnology.com .

216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •

info@dltechnology.com

SMALL REPEATABLE VOLUMES

ARE A CHALLENGE, BUT NOT

IMPOSSIBLE IF YOU HAVE BEEN

CREATING THEM AS LONG AS WE HAVE.

TO DO IT WELL,

WE PROVIDE THREE THINGS:

Dispensing Expertise

in a variety of microelectronic

packaging applications.

Feasibility Testing & Process Verification

based

on years of product engineering, material flow testing

and software control.

Product Development

for patented valves,

dispensing cartridges, needles, and accessories.