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New Advanced Bonding Technologies

LAPLACE “3.5D” Laser Assisted Chip Packaging

vertical connection of chip to die stack (”3.5D”)

3D horizontal die stacking

omitting TSV-VIA structures

laser reflow for lowest thermal and mechanical stress

compatible with solder, pillars, ACF, sinter paste

supporting heterogeneous integration roadmap by

horizontal and vertical bonding of MEMS, ASICs,

interposer, heat sinks, electromagnetic shielding, etc.

selective chip repair

ISO 9001

IATF 16949

ISO 14001

SB²-WB Wire-Solder-Bonding

reliable laser-soldered wire connections for

multifunctional systems and modules

no pressure, vibration or high temperature required

heavy & fine wires: wire bundles, ribbons, optical fibres

wide range of materials: Au, Ag, Cu, Pd, Pt, etc.

flat point-to-point connection

ideal solution for thin, soft and brittle substrates:

VCSEL, GaN, glass, MEMS, etc.

easy damaged-free UBM interface