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Chip Scale Review September • October • 2019



The present study was f inancially

suppor ted by t he Nat ional Science

and Technology Major Project No.




Fa n - ou t wa r s b eg i n ,” h t t p s: // begin

2. R. Tummala, et al., “Fut u re of

embedding and fan-out technologies,”

Micro. Symp. (Pan Pacific), 2017 Pan

Pacific, IEEE, 2017.

3. M. Brunnbauer, et al., “An embedded

device technology based on a molded

reconf igured wafer,” Proc. 56th

IEEE Elec. Comp. and Tech. Conf.

(ECTC), 2006.

4. M. Brunnbauer, et al., “Embedded

wafer-level ball grid array (eWLB),”

Elect. Mfg. Tech. Symp. (IEMT), 2008

33rd IEEE/CPMT Inter. IEEE.

5. K. P r e s sel, et a l., “Embedded

wafer-level ball grid array (eWLB)

technology for system integration,”

With respect to the sweep frequency

and power consumption, the chip has

obvious superiority. Its applications include

intelligent traffic systems, security systems

and unmanned aerial vehicles.


A mmWave (40GHz) package based on



technology has been successfully

demonst rated and discussed in this

ar ticle. Among the attributes of the

technology are its metal shielding layer

and a thick polyimide (PI) layer on the

surface of the die that provides excellent

electrical performance. Compared to

other wafer-level fan-out technologies,



is a manufact uring friendly

technology, because a wafer that uses

it does not differ significantly from a

standard silicon wafer. In combination

with its elimination of the wafer-level

molding process and materials, eSiFO



also a highly cost-competitive technology.

All these advantages make an attractive

choice for various applications.

CPMT Symp. Japan, 2010 IEEE.

6. D. Wang, et al., “Advanced EWLB

(embedded wafer-level ball grid array)

solutions for mmWave applications,”

Proc. of the Inter. Wafer-Level

Packaging Conf. (IWPLC) 2018.

7. R. Li, C. Jin, S. C. Ong, et al.,

“Embedded wafer-level packaging for

77-GHz automotive radar front-end

with through-silicon via and its 3-D

integration,” IEEE Trans. on Comp.

Pkg. & Mfg. Tech., 2013, 3(9):1481-


8. C. Beck, H. J. Ng, R. Agethen, et al.,

“Industrial mmWave radar sensor in

embedded wafer-level BGA packaging

technology,” IEEE Sensors Jour., 2016,


9. D. Yu, et al., “Embedded Si fan-out:

a low cost wafer-level packaging

technology without molding and de-

bonding processes,” Proc. 67th Elec.

Comp. and Tech. Conf. (ECTC), IEEE

Press, June 2017, pp: 28-36.

10. H. S. Gamble, et al., “Low-loss CPW

lines on surface stabilized h


resistivity silicon,” IEE

E Microwave

and Guided Wave Lett. 9.10 (1999):


11. D. Yu, “Embedded silicon fan-out



) technology for wafer-level

system integration,”

Advances in

Embedded and Fan-out Wafer-level

Packaging Technologies

, Wiley, 2019,

Chap. 8, pp. 169-184.

12. S. Ma, et al., “Embedded silicon fan-

out (eSiFO): a promising wafer-level

packaging technology for multi-chip

and 3D system integration,” ECTC,

2018 IEEE 68th.


Li Ma is the manager of the R&D Department at Huatian Kunshan, China, a division of Hua Tian technology

group. He obtained his PhD from Fudan U., Shanghai, China and has two years of post-doctoral experience at the

Institute of Microelectronics of Chinese Academy of Sciences. He has in-depth experience in R&D, especially in

the areas of embedded silicon fan-out and CMOS image sensor packaging. He has almost 20 issued patents.

Linyu Li is an R&D Engineer in the Huatian Group, Kunshan, China. She received a Master’s degree in

Material Engineering from Shanghai U.

Contact author:

Daquan Yu is the CTO of Huatian Group, Kunshan, China. He received a PhD from Dalian U.

of Technology, China; email:

Tong Tian is the CEO and CTO at StorMicro Technologies Co., Ltd., Nantong, China. He received a PhD from Xi’an Jiaotong

U. and was granted the Outstanding Research Award by IME, Singapore. In 2010 he joined SIMIT and was involved in mmWave

and THz research. He held an Associate Editor position at IEEE TCAS II for four years. Currently, his main research areas cover

SiCMOS mmWave single-chip system, SiCMOS RF and analog systems, as well as a human microchip implant system.

Jiabao Niu is an RF engineer at StorMicro Technologies Co., Ltd., Nantong, China. He graduated from Xidian U. with an

MSEE degree. His main research areas are mmWave IC packaging and mmWave antennas.

Figure 6:

The test properties of the 40G mmWave product.