Chip Scale Review September • October • 2019[ChipScaleReview.com]
September • October 2019
Volume 23, Number 5
An illustration of the latest development
towards the integration of ultra-thin
silicon bare dies within a flexible film.
ChipInFlex is a generic wafer-level
process for manufacturing a flexible
label that integrates silicon components.
Working on a silicon carrier helps achieve
a high resolution of integration. The
process described is the first to offer flip-
chip silicon dies interconnection within a
flexible film and collective thinning.
Photo courtesy of CEA-Letiamkor.com ▶ firstname.lastname@example.org
Enabling the Future
Cutting Edge Solutions
for 5G Applications
Amkor’s Antenna in Package/
Antenna on Package (AiP/AoP)
solutions enable highly
integrated mmWave devices
for emerging high-speed,
DEPARTMENTSGuest Editorial 49 Why should we have industry standards? Cristina Chu Energetiq Technology, Inc. Executive Viewpoint 5 R&D challenges associated with emerging technology platforms 12 Embedded silicon fan-out solution for 40GHz mmWave chip packaging Li Ma, Linyu Li, Fan Yang, Daquan Yu, Zhiyi Xiao Huatian Technology (Kunshan) Electronics Co., Ltd. and Tong Tian, Jia bao Niu StorMicro Technologies Co., Ltd. 18 The rising adoption of advanced substrates: IC substrate, SLP and embedded die Mario Ibrahim Yole Développement 24 Inkjet printing: gaining competitive advantage Luca Gautero, Simon Donkers, Wouter Brok Meyer Burger 29 Innovation in inspection and metrology for new manufacturing technologies Scott Jewler SVXR, Inc. 34 Overview and outlook for heterogeneous integrations John H. Lau Unimicron Technology Corporation 41 Burn-in: when, for how long, and at what level? Ephraim Suhir ERS Co. 45 Extreme cooling solution for power electronics and next-generation optoelectronic sensors Philippe Soussan imec 8 Integrating ultra-thin Si dies within a flexible label Jean-Charles Souriau CEA-Leti