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Chip Scale Review September • October • 2019

[ChipScaleReview.com]

CONTENTS

September • October 2019

Volume 23, Number 5

An illustration of the latest development

towards the integration of ultra-thin

silicon bare dies within a flexible film.

ChipInFlex is a generic wafer-level

process for manufacturing a flexible

label that integrates silicon components.

Working on a silicon carrier helps achieve

a high resolution of integration. The

process described is the first to offer flip-

chip silicon dies interconnection within a

flexible film and collective thinning.

Photo courtesy of CEA-Leti

amkor.com sales@amkor.com

Enabling the Future

Cutting Edge Solutions

for 5G Applications

Amkor’s Antenna in Package/

Antenna on Package (AiP/AoP)

solutions enable highly

integrated mmWave devices

for emerging high-speed,

short-range wireless

communications

DEPARTMENTS

Guest Editorial 49 Why should we have industry standards? Cristina Chu Energetiq Technology, Inc. Executive Viewpoint 5 R&D challenges associated with emerging technology platforms 12 Embedded silicon fan-out solution for 40GHz mmWave chip packaging Li Ma, Linyu Li, Fan Yang, Daquan Yu, Zhiyi Xiao Huatian Technology (Kunshan) Electronics Co., Ltd. and Tong Tian, Jia bao Niu StorMicro Technologies Co., Ltd. 18 The rising adoption of advanced substrates: IC substrate, SLP and embedded die Mario Ibrahim Yole Développement 24 Inkjet printing: gaining competitive advantage Luca Gautero, Simon Donkers, Wouter Brok Meyer Burger 29 Innovation in inspection and metrology for new manufacturing technologies Scott Jewler SVXR, Inc. 34 Overview and outlook for heterogeneous integrations John H. Lau Unimicron Technology Corporation 41 Burn-in: when, for how long, and at what level? Ephraim Suhir ERS Co. 45 Extreme cooling solution for power electronics and next-generation optoelectronic sensors Philippe Soussan imec 8 Integrating ultra-thin Si dies within a flexible label Jean-Charles Souriau CEA-Leti

FEATURE ARTICLES