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Chip Scale Review September • October • 2019


Volume 23, Number 5

The International Magazine for Device and Wafer-level Test,

Assembly, and Packaging Addressing

High-density Interconnection of Microelectronic IC's including

3D packages, MEMS, MOEMS,

RF/Wireless, Optoelectronic and Other

Wafer-fabricated Devices for the 21st Century.


Kim Newman Publisher Lawrence Michaels Managing Director/Editor Debra Vogler Senior Technical Editor


Steffen Kröhnert - Advanced Packaging John L. Lau, Ph.D - Advanced Packaging Ephraim Suhir, Ph.D - Reliability Rao R. Tummala, Ph.D - Advanced Packaging


Andy Mackie, Ph.D


Indium Corporation

Rolf Aschenbrenner, Dipl.-Phys.

Fraunhofer IZM

Joseph Fjelstad

Verdant Electronics

Arun Gowda, Ph.D

GE Global Research

John Lau, Ph.D

ASM Pacific Technology

Leon Lin Tingyu, Ph.D

National Center for Advanced

Packaging (NCAP China)


Chip Scale Review

All subscription changes, additions, deletions to any and

all subscriptions should be made by email only to

Advertising Production Inquiries:

Lawrence Michaels

Copyright © 2019 Haley Publishing Inc.

Chip Scale Review (ISSN 1526-1344) is a registered trademark of

Haley Publishing Inc. All rights reserved.

Subscriptions in the U.S. are available without charge to qualified individuals

in the electronics industry. In the U.S. subscriptions by first class mail are

$125 per year. Subscriptions outside of the United States are $225 per year

to other countries.

Chip Scale Review, (ISSN 1526-1344), is published six times a

year with issues in January-February, March-April, May-June, July-

August, September-October and November-December. Periodical

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POSTMASTER: Send address changes to Chip Scale Review magazine

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